Method of forming a structure using selective deposition on a metal surface

A method for forming a structure, the method comprising:

• providing a substrate in a reaction chamber, wherein the substrate comprises a metal surface on at least part of a surface of the substrate;
• performing a growth promotion treatment, wherein the growth promotion treatment comprises pulsing a boron-containing precursor to the reaction chamber and performing a purge;
• and
• selectively depositing a film on the metal surface, wherein depositing the film comprises providing a halide precursor to the reaction chamber.