Sputtering apparatus and control method

Abstract

A sputtering apparatus includes: a holder configured to hold a target; a power supply configured to supply electric power to the holder; a magnet provided on a rear surface of the holder; a magnet driver configured to reciprocate the magnet; and a controller, wherein the controller includes: a power controller configured to control the electric power supplied from the power supply to the holder; a magnet operation controller configured to control the magnet driver; and a power calculator configured to calculate integrated power, which is an integrated value of the electric power supplied from the power supply to the holder for each of regions divided in a direction in which the magnet reciprocates, and wherein the controller controls at least one of the electric power supplied to the holder or a reciprocation speed of the magnet to reduce bias in the integrated power for each of the regions.

Dependencies are inferred from the claim text.