Temperature-control device
AssigneeEBNER Industrieofenbau GmbH
InventorsRobert EBNER, Albert NEUMÜLLER, Markus KÖCK
Life of this patent
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Abstract
A temperature-control device for controlling the temperature of a component, which is transported through the device in a conveying direction along at least one conveying plane, includes a first arrangement of first discharge elements for supplying a first, in particular gaseous, temperature-control medium to the component, and at least one other arrangement of other discharge elements for supplying at least one other, in particular gaseous, temperature-control medium to the component downstream of the first arrangement of first discharge elements in the conveying direction.
Claims16
A temperature-control device (6) for controlling the temperature of a component (2), which is transported through the device in a conveying direction (3) along at least one conveying plane (4), the temperature-control device (6) comprising a first arrangement (12) of first discharge elements (13) for supplying a first, in particular gaseous, temperature-control medium (14) to the component (2), and at least one other arrangement (17) of other discharge elements (18) downstream of the first arrangement (12) of first discharge elements (13) in the conveying direction (3), wherein a first receiving opening (25) of a first receiving device (26) for receiving the first temperature-control fluid (14) is arranged in the region of the first discharge elements (13) for the first temperature-control fluid (14), and the first receiving device (26) is flow-connected to at least one first heat exchanger (29), wherein the first discharge elements (13), the first receiving device (26) and the first heat exchanger (30) are arranged in a first temperature-control fluid circuit (29), wherein multiple first receiving openings (25) are arranged between the first discharge elements (13), wherein, further, the other discharge elements (18) are configured for supplying at least one other, in particular gaseous, temperature-control medium (19) to the component (2), wherein multiple other receiving openings (27) of another receiving device (28) for receiving the other temperature-control fluid (19) are arranged in the region of the other discharge elements (18) for the other temperature-control fluid (19), wherein the other receiving device (28) is flow-connected to at least one other heat exchanger (32), and wherein the other discharge elements (18), the other receiving device (28) and the other heat exchanger (32) are arranged in another temperature-control fluid circuit (30).
6-13. (canceled)
A method for adjusting a microstructure or a microstructure distribution in a metal component (2) comprising the steps:
- heating the component (2) to a first temperature in a furnace (5),
- cooling down the heated component (2) to a second temperature, which is lower than said first temperature, in a temperature-control device (6), to which end a first temperature-control fluid (14), which is discharged from first discharge elements (13), is applied to the component (2) in the temperature-control device (6),
- wherein a first receiving opening (25) of a first receiving device (26) for receiving the first temperature-control fluid (14) is arranged in the region of the first discharge elements (13) for the first temperature-control fluid (14), and the first receiving device (26) is flow-connected to at least one first heat exchanger (29), wherein the first discharge elements (13), the first receiving device (26) and the first heat exchanger (30) are arranged in a first temperature-control fluid circuit (29),
- wherein the first temperature-control fluid (14) is received between the first discharge elements (13) through multiple first receiving openings (25), wherein, after the treatment with the first temperature-control fluid (14), another temperature-control fluid (19), which is discharged from other discharge elements (18), is applied to the component (2) in the temperature-control device (6), wherein multiple other receiving openings (27) of another receiving device (28) for receiving the other temperature-control fluid (19) are arranged in the region of the other discharge elements (18) for the other temperature-control fluid (19), wherein the other receiving device (28) is flow-connected to at least one other heat exchanger (32), and wherein the other discharge elements (18), the other receiving device (28) and the other heat exchanger (32) are arranged in another temperature-control fluid circuit (30).
Dependencies are inferred from the claim text.