Method for forming solute film pattern
AssigneeSeiko Epson Corporation
InventorsMasaya ISHIDA, Toshimitsu HIRAI, Tatsuya FUJII, Hiroshi TAKIGUCHI
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AssigneeSeiko Epson Corporation
InventorsMasaya ISHIDA, Toshimitsu HIRAI, Tatsuya FUJII, Hiroshi TAKIGUCHI
Estimating the term…
A method for forming a solute film pattern includes applying a material liquid to a medium, the material liquid containing water, a humectant having a boiling point of 180°C or higher, a solute, and an additive, the content of the humectant being 10% by mass or more and 30% by mass or less with respect to the total amount of the material liquid, reducing the atmosphere of the material liquid applied to the medium to 3000 Pa, which is the vapor pressure of water at room temperature, and reducing the above atmosphere to a pressure equal to or lower than the vapor pressure of the humectant at room temperature and maintaining the pressure for a certain period of time or longer. The humectant contains one or more of γ-butyrolactone, propylene carbonate, ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, dipropylene glycol, and 1,2-pentanediol.
A method for forming a solute film pattern comprising:
Dependencies are inferred from the claim text.