Apparatus system and method for a curved vacuum chuck for thin substrates

Abstract

An apparatus, system and method for providing a curved vacuum chuck capable of picking and placing a thin film substrate. The embodiments include: a chuck body; a chuck platen having a curvature along at least one axis thereof; at least two rotation points integral with the chuck body and running axially along and at opposing ends of the chuck platen; and a plurality of vacuum ports on a face of the chuck platen which are applied sequentially to the thin film substrate along the axis of curvature as the chuck platen is moved downward in relation to a horizontal axis through the chuck body and is rotated about the rotation points

Dependencies are inferred from the claim text.