Substrate processing apparatus and method for controlling substrate processing apparatus

A substrate processing apparatus configured to processes a substrate, comprising:

• a plurality of processing chambers stacked in a vertical direction;
• a liquid supply mechanism configured to supply a treatment liquid to at least one of the plurality of processing chambers;
• and
• a controller, wherein
• each of the plurality of processing chambers includes
• a chuck configured to hold a substrate, and
• a nozzle configured to discharge the treatment liquid to the substrate held by the chuck,
• the liquid supply mechanism includes
• a feed pipe configured to supply the treatment liquid to a first nozzle that is the nozzle of a first processing chamber among the plurality of processing chambers,
• a filling pump provided in the feed pipe in a layer lower than the first processing chamber,
• a discharge pump provided in the feed pipe between the filling pump and the first nozzle in a layer same as the first processing chamber or in a layer higher than the first processing chamber,
• an inlet valve provided in the feed pipe at an upstream position of the filling pump,
• an outlet valve provided in the feed pipe between the discharge pump and the first nozzle,
• a first intermediate valve provided in the feed pipe between the filling pump and the discharge pump,
• a return pipe configured to connect the discharge pump and a return position in the feed pipe between the first intermediate valve and the inlet valve, and
• a purge valve provided in the return pipe,
• the filling pump includes a filling pressure sensor configured to measure a pressure of the treatment liquid in the filling pump,
• the discharge pump includes a discharge pressure sensor configured to measure a pressure of the treatment liquid in the discharge pump, and
• as a purge operation, the controller is configured to
• open the inlet valve in a state where the outlet valve, the first intermediate valve, and the purge valve are closed to release the treatment liquid in the filling pump to an upstream side of atmospheric pressure of the inlet valve,
• close the inlet valve after a preset time has elapsed since the opening of the inlet valve so that a pressure value measured by the discharge pressure sensor does not become a negative pressure when the purge valve is opened,
• after closing the inlet valve, perform a purge valve opening operation to open the purge valve in a state where the outlet valve and the first intermediate valve are closed, and
• after opening the purge valve, perform an actual purge operation to cause the treatment liquid to be returned from the discharge pump toward the filling pump through the return pipe in a state where the outlet valve and the first intermediate valve are closed.

A method for controlling a substrate processing apparatus configured to processes a substrate,

• the substrate processing apparatus including
• a plurality of processing chambers stacked in a vertical direction, and
• a liquid supply mechanism configured to supply a treatment liquid to at least one of the plurality of processing chambers,
• each of the plurality of processing chambers including
• a chuck configured to hold a substrate, and
• a nozzle configured to discharge the treatment liquid to the substrate held by the chuck,
• the liquid supply mechanism including
• a feed pipe configured to supply the treatment liquid to a first nozzle that is the nozzle of a first processing chamber among the plurality of processing chambers,
• a filling pump provided in the feed pipe in a layer lower than the first processing chamber,
• a discharge pump provided in the feed pipe between the filling pump and the first nozzle in a layer same as the first processing chamber or in a layer higher than the first processing chamber,
• an inlet valve provided in the feed pipe at an upstream position of the filling pump,
• an outlet valve provided in the feed pipe between the discharge pump and the first nozzle,
• a filter provided in the feed pipe between the filling pump and the discharge pump,
• a first intermediate valve provided in the feed pipe between the filling pump and the filter, and
• a second intermediate valve provided in the feed pipe between the filter and the discharge pump,
• the filling pump including a filling pressure sensor configured to measure a pressure of the treatment liquid in the filling pump, and
• the discharge pump including a discharge pressure sensor configured to measure a pressure of the treatment liquid in the discharge pump,
• the method comprising:
• as a pre-filtration operation,
• causing the filling pump to adjust the pressure of the treatment liquid in the filling pump so that a pressure value measured by the filling pressure sensor becomes a first supply pressure in a state where the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve are closed;
• pushing the treatment liquid to the second intermediate valve by opening the first intermediate valve when the pressure value measured by the filling pressure sensor reaches the first supply pressure;
• during a period from the opening of the first intermediate valve to opening of the second intermediate valve, causing the filling pump to adjust the pressure of the treatment liquid in the filling pump so that the pressure value measured by the filling pressure sensor becomes a second supply pressure in a state where the inlet valve and the second intermediate valve are closed;
• after the first intermediate valve is opened, causing the discharge pump to adjust the pressure of the treatment liquid in the discharge pump so that a pressure value measured by the discharge pressure sensor becomes a third supply pressure in a state where the outlet valve and the second intermediate valve are closed;
• and
• opening the second intermediate valve when the pressure value measured by the discharge pressure sensor reaches the third supply pressure, and
• the method further comprising,
• as an actual filtration operation after the pre-filtration operation,
• causing the treatment liquid to be sent from the filling pump toward the discharge pump in a state where the inlet valve and the outlet valve are closed.

A method for controlling a substrate processing apparatus configured to processes a substrate,

• the substrate processing apparatus including
• a plurality of processing chambers stacked in a vertical direction, and
• a liquid supply mechanism configured to supply a treatment liquid to at least one of the plurality of processing chambers,
• each of the plurality of processing chambers including
• a chuck configured to hold a substrate, and
• a nozzle configured to discharge the treatment liquid to the substrate held by the chuck,
• the liquid supply mechanism including
• a feed pipe configured to supply the treatment liquid to a first nozzle that is the nozzle of a first processing chamber among the plurality of processing chambers,
• a filling pump provided in the feed pipe in a layer lower than the first processing chamber,
• a discharge pump provided in the feed pipe between the filling pump and the first nozzle in a layer same as the first processing chamber or in a layer higher than the first processing chamber,
• an inlet valve provided in the feed pipe at an upstream position of the filling pump,
• an outlet valve provided in the feed pipe between the discharge pump and the first nozzle,
• a first intermediate valve provided in the feed pipe between the filling pump and the discharge pump,
• a return pipe configured to connect the discharge pump and a return position in the feed pipe between the first intermediate valve and the inlet valve, and
• a purge valve provided in the return pipe,
• the filling pump including a filling pressure sensor configured to measure a pressure of the treatment liquid in the filling pump, and
• the discharge pump including a discharge pressure sensor configured to measure a pressure of the treatment liquid in the discharge pump,
• the method comprising:
• as a purge operation,
• opening the inlet valve in a state where the outlet valve, the first intermediate valve, and the purge valve are closed to release the treatment liquid in the filling pump to an upstream side of atmospheric pressure of the inlet valve;
• closing the inlet valve after a preset time has elapsed since the opening of the inlet valve so that a pressure value measured by the discharge pressure sensor does not become a negative pressure when the purge valve is opened;
• after closing the inlet valve, performing a purge valve opening operation to open the purge valve in a state where the outlet valve and the first intermediate valve are closed;
• and
• after opening the purge valve, performing an actual purge operation to cause the treatment liquid to be returned from the discharge pump toward the filling pump through the return pipe in a state where the outlet valve and the first intermediate valve are closed.