Light-Emitting Diode and Light-Emitting Device Including the Same
AssigneeXiamen San'an Optoelectronics Co., Ltd.
InventorsXiushan ZHU, Yan LI
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Abstract
A light-emitting diode includes an epitaxial structure, at least one via hole, a first insulation layer, a first connecting electrode, a second connecting electrode, a second insulation layer, a first pad, and a second pad. The first insulation layer includes a first insulation portion and a second insulation portion such that an upper surface of the first connecting electrode and an upper surface of the second connecting electrode are disposed on the same level so as to ensure that an upper surface of the first pad and an upper surface of the second pad are also on the same level.
Claims18
A light-emitting diode comprising:
- an epitaxial structure including a first semiconductor layer, a light-emitting layer disposed on said first semiconductor layer, and a second semiconductor layer disposed on said light-emitting layer;
- at least one via hole extending downwardly from a portion of an upper surface of said second semiconductor layer and through said light-emitting layer to terminate at said first semiconductor layer;
- a reflective layer disposed on said second semiconductor layer;
- a blocking layer covering said reflective layer;
- a first insulation layer disposed on said blocking layer and provided with at least one first opening and at least one second opening;
- a first connecting electrode disposed on said first insulation layer and electrically connected to said first semiconductor layer through said at least one first opening;
- a second connecting electrode covering an upper surface and a sidewall of said first insulation layer and electrically connected to said second semiconductor layer through said at least one second opening;
- a second insulation layer disposed on said first connecting electrode and said second connecting electrode, and provided with a third opening and a fourth opening;
- a first pad disposed on said first connecting electrode, and electrically connected to said first connecting electrode through said third opening;
- and
- a second pad disposed on said second connecting electrode, and electrically connected to said second connecting electrode through said fourth opening;
- wherein vertical projection of said at least one via hole on an upper surface of said first semiconductor layer does not overlap vertical projection of each of said first pad and said second pad on said upper surface of said first semiconductor layer, and
- wherein said second opening exposes a portion of said blocking layer, and said second connecting electrode is electrically connected to said blocking layer through said second opening.
Dependencies are inferred from the claim text.