External heat dissipation module, server assembly, server system
AssigneePegatron Corporation
InventorsHsiang-Yu Huang, Fu-Jen Yang, Wei-Cheng Liu
Life of this patent
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AssigneePegatron Corporation
InventorsHsiang-Yu Huang, Fu-Jen Yang, Wei-Cheng Liu
Estimating the term…
An external heat dissipation module is connected to a server and includes a chassis, a liquid inlet connector, a liquid outlet connector, a liquid cooling radiator, and first and second pipelines. The liquid inlet connector and the liquid outlet connector are exposed from the chassis and are arranged at a same side of the chassis. The liquid cooling radiator and the first and second pipelines are located inside the chassis. The first pipeline is connected to the liquid inlet connector and the liquid cooling radiator. The second pipeline is connected to the liquid outlet connector and the liquid cooling radiator. Liquid in the server flows from the liquid inlet connector to the liquid cooling radiator through the first pipeline, and after being cooled by the liquid cooling radiator, flowing back to the server from the liquid cooling radiator to the liquid outlet connector through the second pipeline.
An external heat dissipation module adapted to be connected to a server, comprising:
Dependencies are inferred from the claim text.