Multi-head afm for defect inspection and review
AssigneeNearfield Instruments B.V.
InventorsArtem KHACHATURIANTS, Cornel BOZDOG, Seokhan KIM
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AssigneeNearfield Instruments B.V.
InventorsArtem KHACHATURIANTS, Cornel BOZDOG, Seokhan KIM
Estimating the term…
Method of inspecting and reviewing defects in substrates using a scanning probe microscope comprising multiple scanning heads and a substrate carrier, wherein each of the multiple scanning heads comprises a probe including a probe tip arranged for scanning of a substrate surface, wherein the method comprises:—providing the substrate on the substrate carrier, wherein the substrate carrier is arranged to position the substrate relative to at least one of the multiple scanning heads;—scanning of the substrate surface in a first scanning mode using at least one first scanning head of the multiple scanning heads;—scanning of the substrate surface in a second scanning mode using at least one second scanning head of the multiple scanning heads, wherein the at least one first scanning head and the at least one second scanning head are different scanning heads of the multiple scanning heads;—wherein the first scanning mode has a lower scanning resolution than the second scanning mode.
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