Target assembly and method for manufacturing target assembly

Abstract

A target assembly and manufacturing method are provided to prevent a drop in joining strength between a copper or copper alloy backing plate and an aluminum or aluminum alloy insert plate, and between a tungsten or molybdenum target and the insert plate, by suppressing intermetallic compound formation. The assembly includes a target of tungsten or molybdenum, a backing plate of copper or a copper alloy, and an insert material of aluminum or an aluminum alloy. The target is diffusion-bonded to the backing plate via the insert material. Diffusion bonding is mediated by a thin metal film laver positioned between the target and insert material, and between the backing plate and insert material. The film is formed of Ti, V, Cr, Nb, Pd, Ir, Pt, or an alloy containing one or more of these metals, with a thickness greater than 0.1 μm and not more than 3.0 μm.

Dependencies are inferred from the claim text.