Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsPo-Chin HUANG, Peitsen WU
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AssigneeKabushiki Kaisha Toshiba
InventorsPo-Chin HUANG, Peitsen WU
Estimating the term…
According to one embodiment, a semiconductor device includes first to sixth electrodes a semiconductor member, a first insulating member, and a second insulating member. The semiconductor member includes a first semiconductor region including Alx1Ga1-x1N (0<x1≤1), a second semiconductor region including Alx2Ga1-x2N (0≤x2<1, x2<x1), and a third semiconductor region including Alx3Ga1-x3N (0<x3≤1, x2<x3). At least a part of the first insulating member is between the third electrode and the semiconductor member. At least a part of the second insulating member is between the sixth electrode and the semiconductor member. A <0001> direction of the first semiconductor region is along a first orientation from the second semiconductor region to the first semiconductor region.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.