US 2026/0276800 A1 · METHOD FOR FABRICATING AN ULTRASONIC PROBE AND CORRESPONDING ULTRASONIC PROBE

Abstract

The present description concerns a method of manufacturing an ultrasonic probe comprising:—the forming of a dielectric layer on an edge of an acoustic stack comprising a piezoelectric layer located on a first portion of an interconnection substrate, said first portion being on an acoustic attenuation layer and being continued by a second portion folded over an edge of the acoustic attenuation layer;—the forming of a conductive grounding structure on transducer elements formed in the acoustic stack and separated by notches in the acoustic stack across its thickness all the way to the interconnection substrate; said conductive grounding structure extending over the dielectric layer and being coupled to an electrical contact pad of the interconnection substrate; and—the forming of a protective layer to cover and surround the acoustic stack and the conductive grounding structure along the height of the notches.

Claims18

Dependent claims

Method of manufacturing an ultrasonic probe, the method comprising:

the forming of a dielectric layer on at least one edge of an acoustic stack comprising at least one piezoelectric layer located on a first portion of an interconnection substrate, said first portion of said interconnection substrate being on an acoustic attenuation layer and being continued by a second portion of the interconnection substrate folded over an edge of the acoustic attenuation layer;
the forming of a conductive grounding structure on transducer elements formed in the acoustic stack and separated by notches resulting from the cutting of the acoustic stack across its entire thickness, said cutting extending at least all the way to the interconnection substrate;
said conductive grounding structure extending over the dielectric layer and being coupled to at least one electrical contact pad of the interconnection substrate;
the forming of a protective layer to cover and surround the acoustic stack and the conductive grounding structure at least along the height of the notches.

1 more element

Ultrasonic probe comprising:

an interconnection substrate comprising at least a first portion and a second portion coupled to the first portion;
an acoustic stack comprising at least one piezoelectric layer located on the first portion of the interconnection substrate;
a dielectric layer on at least one edge of the acoustic stack;
an acoustic attenuation layer, the first portion of the interconnection substrate being between said acoustic attenuation layer and the piezoelectric layer, and the second portion of the interconnection substrate being folded over an edge of said acoustic attenuation layer;
the acoustic stack being divided into a plurality of transducer elements separated by notches extending through said acoustic stack across its entire thickness, said notches extending through at least the first portion of the interconnection substrate and extending all the way into the acoustic attenuation layer;
a conductive grounding structure coupled to each of the transducer elements, the conductive grounding structure extending over the dielectric layer and being coupled to at least one electrical contact pad of the interconnection substrate;
and
a protective layer covering and surrounding the acoustic stack and the conductive grounding structure at least along the height of the notches.

5 more elements

Dependencies are inferred from the claim text.

Method for fabricating an ultrasonic probe and corresponding ultrasonic probe

Life of this patent

Method for fabricating an ultrasonic probe and corresponding ultrasonic probe

Life of this patent

Abstract

Claims18