Acoustic transducer assembly with molded interconnect device (mid)
AssigneeEvident Scientific, Inc.
InventorRonald Kellner
Life of this patent
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Abstract
An acoustic transducer assembly can be fabricated using a molded interconnect device (MID) approach. For example, respective conductive interconnections can be formed on an interior surface of a cavity defined by a molded dielectric housing. A piezoelectric element can be arranged within the cavity and fed electrically by the formed conductive interconnections. A backing material can be established within the cavity, such as filled and cured. A portion, such as a wall, of the molded dielectric housing can provide an acoustic matching layer.
Claims20
An acoustic transducer assembly for non-destructive test (NDT), the acoustic transducer assembly comprising:
- a molded dielectric housing defining a cavity;
- a piezoelectric element located within the cavity, the piezoelectric element fixed to the dielectric housing and arranged to generate and receive acoustic energy coupled through the dielectric housing to and from an exterior face of the dielectric housing;
- conductive interconnections comprising metallization formed on an interior surface defined by the cavity, the conductive interconnections electrically coupled with respective regions of the piezoelectric element;
- and
- a backing material located within the cavity upon a surface of the piezoelectric element opposite a surface of the piezoelectric element fixed to the dielectric housing.
A method for fabricating an acoustic transducer assembly for non-destructive test (NDT), the method comprising:
- forming conductive interconnections comprising metallization on an interior surface of a cavity defined by a molded dielectric housing;
- arranging a piezoelectric element within the cavity including:
- fixing the piezoelectric element to the dielectric housing, the piezoelectric element arranged to generate and receive acoustic energy coupled through the dielectric housing to and from an exterior face of the dielectric housing;
- and
- electrically coupling the conductive interconnections with respective regions of the piezoelectric element;
- and
- establishing a backing material within the cavity upon a surface of the piezoelectric element opposite a surface of the piezoelectric element fixed to the dielectric housing.
A method for fabricating an acoustic transducer assembly for non-destructive test (NDT), the method comprising:
- molding a dielectric housing defining a cavity;
- laser-activating respective regions of an unmachined surface of the dielectric housing in a pattern corresponding to conductive interconnections on an interior surface of the cavity;
- forming the conductive interconnections in the pattern by plating the laser-activated regions;
- arranging a piezoelectric element within the cavity including:
- fixing the piezoelectric element to the dielectric housing using an adhesive, the piezoelectric element arranged to generate and receive acoustic energy coupled through the dielectric housing to and from an exterior face of the dielectric housing;
- and
- electrically coupling the conductive interconnections with respective regions of the piezoelectric element;
- and
- establishing a backing material within the cavity upon a surface of the piezoelectric element opposite a surface of the piezoelectric element fixed to the dielectric housing.
Dependencies are inferred from the claim text.