Light emitting diode package structure and manufacturing method thereof

A manufacturing method of a light emitting diode package structure, comprising:

• disposing a plurality of light emitting diode elements on a surface of a conductive substrate, wherein a light emitting surface of each of the light emitting diode elements faces toward the conductive substrate;
• forming a first insulating layer on the surface of the conductive substrate, wherein the light emitting diode elements are embedded in the first insulating layer;
• forming a plurality of first through holes at the first insulating layer, wherein a connecting surface of each of the light emitting diode elements is exposed to each of the first through holes which is corresponding to each of the light emitting diode elements;
• forming a first conductive layer, wherein the first conductive layer is connected to the first insulating layer and the connecting surface of each of the light emitting diode elements, and the first insulating layer is located between the first conductive layer and the conductive substrate;
• forming a second insulating layer, wherein the second insulating layer is connected to the first conductive layer, and the first conductive layer is located between the first insulating layer and second insulating layer;
• forming a plurality of second through holes at the second insulating layer, wherein a part of the first conductive layer is exposed to the second through holes;
• and
• disposing a second conductive layer in the second through holes, wherein the second conductive layer is connected to the first conductive layer so as to obtain the light emitting diode package structure;
• wherein, the conductive substrate is a transparent conductive substrate.