Direct and selective mass transfer process for microled display fabrication

A method, comprising:

• aligning a transfer piece with a receiving piece, the receiving piece comprising:
• a bonder stage;
• a backplane disposed on the bonder stage;
• and
• backplane electrodes disposed on the backplane;
• heating the transfer piece to a first temperature and heating the receiving piece to a second temperature;
• applying pressure to the transfer piece, the transfer piece comprising:
• a bonder head;
• a plate coupled to the bonder head;
• micro-LEDs coupled to the plate;
• and
• micro-LED electrodes coupled to each of the micro-LEDs;
• alloying the backplane electrodes with the micro-LED electrodes;
• decreasing the second temperature;
• applying a clamp to the transfer piece;
• applying a laser to the clamp;
• and
• vaporizing an interface between the plate and the micro-LEDs.

A method, comprising:

• aligning a transfer piece with a receiving piece, the receiving piece comprising:
• a bonder stage;
• a backplane disposed on the bonder stage;
• and
• backplane electrodes disposed on the backplane, each backplane electrode comprising a first material;
• heating the transfer piece to a first temperature and heating the receiving piece to a second temperature;
• applying pressure to the transfer piece, the transfer piece comprising:
• a bonder head;
• a plate coupled to the bonder head;
• micro-LEDs coupled to the plate;
• and
• micro-LED electrodes coupled to each of the micro-LEDs, the micro-LED electrodes comprising a second material;
• forming an alloy of the first material and the second material between the backplane electrodes and the micro-LED electrodes;
• decreasing the second temperature;
• applying a clamp to the transfer piece;
• applying a laser to the clamp;
• and
• vaporizing an interface between the plate and the micro-LEDs.