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US 2026/0271223 A1Published application
Computer Component Cooling Systems
AssigneeAGT-USA, Inc.
InventorSteven J. Barberi
Life of this patent
Estimating the term…
Abstract
Systems for cooling computer systems in housings. The housing are made up of several panels making up the housing and thee panels have coolant channels within the panel walls. A first coolant is disposed within the housing, in direct contact with heat generating computer components. A second coolant is circulated through the channels, removing heat form the first coolant. The second coolant is passed to a heat exchanger, and is cooled by a third coolant (building chilled water, for example).
Claims15
A computer component cooling system comprising:
- a housing (2) for housing computer components, said housing comprising housing panels including a top panel (2T), bottom panel (2B), first side panel (2R) and second side panel (2L), a front end panel (3F) and a back end panel (3B), wherein at least one of housing panels includes a coolant channel (any one of 4L, 4R, 4C, 5S, or 5R) disposed between an exterior wall of the panel and an interior wall of the panel;
- wherein the housing includes a gas intake aperture (34) and a gas outlet aperture (34 35);
- a fan (24) disposed in fluid communication with the apertures (34, 35) and an interior space of the housing, said fan (24) configured to draw cooling gas into the housing through the gas intake aperture (34) and exhaust gas through the gas outlet aperture (35);
- and
- a heat exchanger (10) in fluid communication with the coolant channels, through a supply line (13) and return line (14), establishing a coolant loop (4 or 5, 13, 14) for flow of a secondary coolant through the at least one of housing panels;
- and
- a pump (15) operable to pump the secondary coolant through the coolant loop (4 or 5, 13, 14) and heat exchanger.
4 more elements
A computer component cooling system comprising:
- a housing (2) for housing computer components including a heat-generating computer component (9), said housing comprising housing panels including a top panel (2T), bottom panel (2B), first side panel (2R) and second side panel (2L), a front end panel (3F) and a back end panel (3B);
- a cooling module (25) disposed in thermal contact with the heat-generating computer component (9);
- an endplate manifold (41) integrated with one of the front or back end panels (3) of the housing, the endplate manifold comprising:
- a coolant supply port (11) and a coolant return port (12) configured for connection to an external heat exchanger (10);
- a supply plenum (42) and a return plenum (43) disposed within the endplate manifold (41);
- and
- a direct-to-chip coolant supply line (26) extending from the supply plenum (42) to the cooling module (25);
- a direct-to-chip coolant return line (27 extending from the cooling module (25) to the return plenum (43);
- wherein
- the coolant supply port (11), supply plenum (42), direct-to-chip coolant supply line (26), cooling module (25), direct-to-chip coolant return line (27), return plenum (43), and coolant return port (12) establish a coolant flow path between the external heat exchanger (10) and the cooling module (25).
7 more elements
Dependencies are inferred from the claim text.