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US 2026/0265901 A1Published application
Method for manufacturing composite heat dissipation structure
AssigneeCMTEK Co., Ltd.
InventorsCHIN-JUI LIANG, CHIA-CHIANG YANG, Yu-Wei Tsai, LI-HSIANG CHEN, CHIN-PING LIN
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Abstract
A method for manufacturing a composite heat dissipation structure. A rigid porous carrier made of a hard material including silicon carbide is first provided. Then, a metal vapor infiltration treatment is performed on the rigid porous carrier. The metal vapor infiltration treatment includes vaporizing a melt of a high-thermal-conductivity metal material to produce a vapor mixture that penetrates into pores of the rigid porous carrier.
Claims10
A method for manufacturing a composite heat dissipation structure, comprising:
- providing a rigid porous carrier, the rigid porous carrier being made of a hard material including silicon carbide;
- and
- performing a metal vapor infiltration treatment on the rigid porous carrier, wherein the metal vapor infiltration treatment includes vaporizing a melt of a high-thermal-conductivity metal material to produce a vapor mixture that penetrates into pores of the rigid porous carrier.
Dependencies are inferred from the claim text.