Method of peeling pressure sensitive adhesive tape from fragile substrate

A method of peeling a pressure sensitive adhesive tape from a fragile substrate without damaging the fragile substrate, the fragile substrate being a substrate having property of being damaged by a pressure sensitive adhesion of 0.5 N/25 mm or more,

• wherein the pressure sensitive adhesive tape comprises a cured product of a curable perfluoropolyether adhesive composition containing the following components (A) to (D):
• (A) 100 to 40 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit —CaF2aO— in a main chain, “a” being an integer of 1 to 6;
• (D) 0 to 60 parts by mass of a polyfluoromonoalkenyl compound having one alkenyl group per molecule and having a perfluoropolyether structure in a main chain, a total amount of the components (A) and (D) being 100 parts by mass;
• (B) an effective curing amount of an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule;
• and
• (C) a catalytic amount of a hydrosilylation-reaction catalyst, and
• wherein the curable perfluoropolyether adhesive composition forms a pressure sensitive adhesive having a pressure sensitive adhesion of less than 0.5 N/25 mm.