Liquid-flow cooling device
AssigneeCooler Master Co., Ltd.
InventorsStefan POPESKU, Shang-Ting HUANG
Life of this patent
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AssigneeCooler Master Co., Ltd.
InventorsStefan POPESKU, Shang-Ting HUANG
Estimating the term…
Liquid-flow cooling device for cooling heat source comprises pump body comprising pump housing with a liquid flow chamber and impeller rotatably located therein, and water-cooling head fitted to pump housing and having heat exchange chamber and thermal contact face. Heat exchange chamber is connected to liquid flow chamber of pump housing, and thermal contact face faces away from heat exchange chamber. Axis of impeller is perpendicular to a normal to the thermal contact face. Water-cooling head comprises multiple cooling fins in heat exchange chamber. Cooling fins comprise multiple densely distributed cooling fins arranged side by side adjacently to each other and multiple sparsely distributed cooling fins arranged side by side adjacently to each other. Densely distributed cooling fins located at one side of sparsely distributed cooling fins. Interval between any two adjacent densely distributed cooling fins is smaller than interval between any two adjacent sparsely distributed cooling fins.
A liquid-flow cooling device for cooling a heat source, the liquid-flow cooling device comprising:
A liquid-flow cooling device for cooling a heat source, the liquid-flow cooling device comprising:
Dependencies are inferred from the claim text.