Multilayer ceramic electronic component, and manufacturing method for multilayer ceramic electronic component

A manufacturing method for a multilayer ceramic electronic component, the manufacturing method comprising:

• forming a multilayer body in which a plurality of ceramic layers and a plurality of internal electrode layers are alternately laminated;
• applying a resin electrode conductive paste onto the multilayer body, the resin electrode conductive paste including a plurality of electrically conductive filler precursor particles and a resin precursor, the plurality of electrically conductive filler precursor particles each including a Cu particle as a core, the Cu particle including a surface coated with Ag with a thickness greater than or equal to about 3 nm and less than or equal to about 100 nm;
• and
• forming a resin electrode layer including a plurality of electrically conductive filler particles and a resin by subjecting the resin electrode conductive paste to a curing treatment in an atmosphere higher than or equal to about 180° C. and lower than or equal to about 230° C., the plurality of electrically conductive filler particles being obtained by curing the plurality of electrically conductive filler precursor particles, the resin being obtained by curing the resin precursor;
• wherein
• through the curing, at least some of the plurality of electrically conductive filler particles include a Cu particle as a core and at least a portion of a surface of the Cu particle including a Cu—Ag alloy including Cu and Ag.