Bonding sheet and method for producing bonded body
AssigneeMitsubishi Materials Corporation
InventorsKotaro Masuyama, Kiyotaka Nakaya
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Abstract
To appropriately bond members together. A bonding sheet includes a sintered body of copper in which at least some of first copper particles having an average particle diameter of 1 μm or more and 16 μm or less and second copper particles having an average particle diameter of 300 nm or less are sintered, and has a specific surface area of 0.16 m2/g or more and 2.44 m2/g or less and a Young's modulus of 25 GPa or less.
Claims5
A bonding sheet comprising a sintered body of copper in which at least some of first copper particles having an average particle diameter of 1 μm or more and 16 μm or less and second copper particles having an average particle diameter of 300 nm or less are sintered, the bonding sheet having a specific surface area of 0.16 m2/g or more and 2.44 m2/g or less and a Young's modulus of 25 GPa or less.
Dependencies are inferred from the claim text.