Imaging integrated circuit device and method of making same

A method, comprising:

• forming a first dielectric structure on a substrate for an IC die;
• forming a first conductive layer on the first dielectric structure;
• forming a dielectric layer on the first conductive layer;
• forming a second conductive layer on the dielectric layer;
• removing at least one portion of the second conductive layer to form a plurality of upper conductive elements;
• removing at least one portion of the dielectric layer lateral to the plurality of upper conductive elements to form at least one dielectric element disposed under the plurality of upper conductive elements;
• removing at least one portion of the first conductive layer lateral to the plurality of upper conductive elements to form a single lower conductive element disposed under the at least one dielectric element and extending laterally into a peripheral area beyond a perimeter of each of the plurality of upper conductive elements;
• forming a plurality of first conductive structures in a second dielectric structure disposed over the first dielectric structure, wherein each of the plurality of first conductive structures connects to a corresponding one of the plurality of upper conductive elements and extends to an upper side of the second dielectric structure;
• and
• bonding the upper side of the second dielectric structure to an upper side of another IC die comprising a plurality of pixel circuits to electrically couple each of the plurality of upper conductive elements to a corresponding one of the plurality of pixel circuits.