Optical module

An optical module, comprising:

• a stem having a main surface and a back surface opposite to the main surface;
• a lead penetrating the stem from the main surface to the back surface;
• a first support provided on the main surface of the stem;
• a submount provided on the first support;
• a laser and a modulator provided on the submount;
• a first high-frequency line provided on the submount and configured to transmit a high-frequency signal to the modulator;
• a first ground pattern provided on the submount;
• a second support provided on the main surface of the stem;
• a connection substrate provided on the second support;
• a second high-frequency line provided on the connection substrate, and configured to receive the high-frequency signal from the lead, and transmit the high-frequency signal to the first high-frequency line;
• a second ground pattern provided on the connection substrate;
• and
• a plurality of wires connecting a pair of patterns, which are the first high-frequency line and the second high-frequency line, or the first ground pattern and the second ground pattern, wherein
• one end of each of the plurality of wires is connected to one of the pair of patterns, and the other end of each of the plurality of wires is provided on the other of the pair of patterns so as to overlap each other.

An optical module, comprising:

• a stem having a main surface and a back surface opposite to the main surface;
• a lead penetrating the stem from the main surface to the back surface;
• a first support provided on the main surface of the stem;
• a submount provided on the first support;
• a laser and a modulator provided on the submount;
• a first high-frequency line provided on the submount and configured to transmit a high-frequency signal to the modulator;
• a capacitor pattern provided on the submount and electrically connected to an electrode of the modulator;
• a capacitor;
• a second support provided on the main surface of the stem;
• a connection substrate provided on the second support;
• a second high-frequency line provided on the connection substrate, and configured to receive the high-frequency signal from the lead, and transmit the high-frequency signal to the first high-frequency line;
• and
• a plurality of wires connecting the capacitor pattern and the capacitor, wherein
• one end of each of the plurality of wires is connected to one of the capacitor and the capacitor pattern, and the other end of each of the plurality of wires is provided on the other of the capacitor and the capacitor pattern so as to overlap each other.

An optical module, comprising:

• a stem having a main surface and a back surface opposite to the main surface;
• a lead penetrating the stem from the main surface to the back surface;
• a first support provided on the main surface of the stem;
• a submount provided on the first support;
• a laser and a modulator provided on the submount;
• a first high-frequency line provided on the submount and configured to transmit a high-frequency signal to the modulator;
• a pair of first ground patterns provided on both sides of the first high-frequency line in the submount;
• a second support provided on the main surface of the stem;
• a connection substrate provided on the second support;
• a second high-frequency line provided on the connection substrate, and configured to receive the high-frequency signal from the lead, and transmit the high-frequency signal to the first high-frequency line;
• a pair of second ground patterns provided on both sides of the second high-frequency line in the connection board;
• and
• a wire connecting two patterns, which are provided on mutually opposite sides when the first high-frequency line is viewed from the second high-frequency line, among the pair of first ground patterns and the pair of second ground patterns.

An optical module, comprising:

• a stem having a main surface and a back surface opposite to the main surface;
• a lead penetrating the stem from the main surface to the back surface;
• a first support provided on the main surface of the stem;
• a submount provided on the first support;
• a laser and a modulator provided on the submount;
• a first high-frequency line provided on the submount;
• a second support provided on the main surface of the stem;
• a connection substrate provided on the second support;
• a second high-frequency line provided on the connection substrate, and configured to receive a high-frequency signal from the lead, and transmit the high-frequency signal to the first high-frequency line;
• a modulator electrode provided on the modulator;
• a bump bond provided on the modulator electrode;
• and
• a connection material having conductivity, that connects the first high-frequency line and the bump bond, and has a wider width than the modulator electrode.