Submodule for single packaging type semiconductor transformer with excellent insulation performance

Abstract

Provided is a submodule for a single packaging type semiconductor transformer with excellent insulation performance, which is capable of improving insulation performance by securing a separation distance between a high-voltage part and a low-voltage part in a semiconductor transformer, and which secures insulation performance by separately providing cooling passages for the high-voltage part and the low-voltage part within the submodule for a semiconductor transformer, while reducing electrical radiation noise and suppressing inflow thereof while at the same time cooling heat generated from a semiconductor device and a switching module with a water-cooled heat sink. The submodule for a single packaging type semiconductor transformer with excellent insulation performance comprises: a high-voltage part that converts high-voltage, low-frequency AC power into high-voltage AC power; a transformer part that converts high-voltage AC power into low-voltage AC power; and a low-voltage part that converts low-voltage AC power to low-voltage DC power.

Dependencies are inferred from the claim text.