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US 2026/0251970 A1Published application
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing circuit board
OwnerNaoki HIRAMATSU, Keishi ONO +2inventors
InventorsNaoki HIRAMATSU, Keishi ONO, Mao NARITA, Shiho TANAKA
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Abstract
A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.
Claims11
A photosensitive resin composition comprising:
- a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a solvent, wherein
- the solvent includes at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.
Dependencies are inferred from the claim text.