Inductor for semiconductor package

A semiconductor package comprising:

• an interconnect having a mounting surface;
• a conductive inductor structure mounted on the interconnect, the conductive inductor structure comprising:
• a first leg region comprising:
• a first bar extending orthogonally from the mounting surface to a given height;
• and
• a first solderable member soldered to the mounting surface, the first solderable member is connected to the first bar and extends parallel to the mounting surface of the interconnect;
• and
• a second leg comprising:
• a second bar extending orthogonally from the mounting surface to the given height;
• and
• a second solderable member soldered to the mounting surface, the second solderable member is connected to the second bar and extends parallel to the mounting surface of the interconnect;
• a connecting bar extending at the given height between the first bar of the first leg region and the second bar of second leg region;
• and
• a magnetic mold compound encasing the conductive inductor structure, wherein the magnetic mold compound and the conductive inductor structure form an inductor.