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US 2026/0247532 A1Published application
Printed Circuit Board Module, Power Electronic Device and Method for Assembling the Power Electronic Device
AssigneeSiemens Aktiengesellschaft
InventorsBin Yang, Bao Lin Li, Jin Kang Wen, Jing Yi Xue, Jing Yi Xue, Christian Frana, Alexander Roppelt, Jonas Honig
Life of this patent
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Abstract
Some embodiments of the teachings herein include a PCB module. An example comprises: a PCB support plate configured to for vertical assembly with a base plate via slot-column structure, wherein the base plate is assembled in a power electronic device; and a PCB configured to be assembled on the PCB support plate.
Claims10
A PCB module comprising:
- a PCB support plate configured to for vertical assembly with a base plate via slot-column structure, wherein the base plate is assembled in a power electronic device;
- and
- a PCB configured to be assembled on the PCB support plate.
A power electronic device comprising:
- a base plate;
- a PCB module comprising
- a PCB support plate configured for vertical assembly with the base plate via slot-column structure;
- and
- a PCB configured for assembly on the PCB support plate.
2 more elements
A method for assembling a power electronic device, the method comprising:
- pre-assembling a PCB on a PCB support plate to form a PCB module;
- vertically assembling the PCB module with a base plate in the power electronic device via slot-column structure.
Dependencies are inferred from the claim text.