Semiconductor module

Abstract

Provided is a semiconductor module capable of ensuring current capacity by adopting bipolar chips to reduce cost. The semiconductor module includes a first switch element area, a second switch element area, and a third switch element area. The first switch element area and the third switch element area are configured in a manner of sandwiching the second switch element area. A first switching element, a second switching element, and a third switching element are respectively disposed in the first switch element area, the second switch element area, and the third switch element area. The first switching element, the second switching element, and the third switching element are sequentially connected in series. The second switching element has a bipolar chip and a unipolar chip connected in parallel.

Dependencies are inferred from the claim text.