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US 2026/0244839 A1Published application
Modularization for data collection for large data models in advanced packaging interconnects
OwnerMercy J. Daniel Agueborinventor
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OwnerMercy J. Daniel Agueborinventor
Estimating the term…
Modularized data collection and modeling for interconnect structures in advanced semiconductor packaging can utilize interconnect models representing distinct interconnect components, such as controlled collapse chip connection (C4) bumps, microstrip lines, striplines, and vias. Each interconnect model can encapsulate electrical characteristics of a corresponding interconnect structure, such as impedance, insertion loss, return loss, and frequency-dependent loss parameters. The interconnect models can be validated against empirical measurement data to align simulated interconnect behavior with real-world performance. Parameter data from each interconnect model can be cascaded to generate a system-level interconnect simulation. The interconnect models can be encoded into a predictive model that generates parameterized predictions based on interconnect design variations. The predictive model can enable rapid design space exploration by allowing adjustment of interconnect parameters such as trace width, substrate thickness, and material selection. Optimized interconnect configurations can be generated to meet signal integrity requirements, impedance matching, and thermal constraints.
A computer-implemented method comprising:
A system comprising:
A non-transitory computer-readable medium storing instructions that, when executed by one or more processors, cause the one or more processors to:
Dependencies are inferred from the claim text.