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US 2026/0242971 A1Published application
Compositions for gold electrodeposition and method of using the same
AssigneeMacDermid Enthone Inc.
InventorsDolores Ross, Brian Gokey, Adam Letize, Thomas B. Richardson, Kyle M. Whitten, Elie H. Najjar
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Abstract
A gold electroplating bath comprising (a) a source of gold ions, (b) a sulfite compound, (c) a chelating agent, (d) an organic accelerator, (e) a suppressor, (f) optionally, a pH adjuster, and (g) balance water. The gold electroplating bath can be used for electroplating a gold deposit onto a substrate comprising one or more features.
Claims18
A gold electroplating bath comprising:
- a. a source of gold ions;
- b. a complexing agent;
- c. an organic accelerator;
- d. a suppressor;
- e. optionally, a pH adjuster;
- and
- f. balance water.
4 more elements
Dependencies are inferred from the claim text.