Polishing composition, concentrated liquid of polishing composition, and polishing method
AssigneeFujimi Incorporated
InventorsTakatoshi MUKAI, Keisuke NUMATA, Takehiko MURASE, Maki ASADA, Kohsuke TSUCHIYA
Life of this patent
Estimating the term…
Loading patent…
AssigneeFujimi Incorporated
InventorsTakatoshi MUKAI, Keisuke NUMATA, Takehiko MURASE, Maki ASADA, Kohsuke TSUCHIYA
Estimating the term…
The present invention provides a polishing composition capable of improving the surface quality of an object to be polished after polishing. The present disclosure relates to the polishing composition comprising (A) an abrasive, (B) Compound α having a polyethylene oxide structure and a polypropylene oxide structure, (C) a water soluble polymer different from the Compound α, (D) a basic compound, and (E) a dispersion medium, wherein (B) the Compound α is contained in an amount of 0.0001 mass % or more relative to the total mass of the polishing composition, and the ratio of the total mass of (B) the Compound α and (C) the water soluble polymer to the mass of (A) the abrasive, [{(B)+(C)}/(A)], is 0.058 or more and less than 0.150.
1-7. (canceled)
A polishing composition comprising
Dependencies are inferred from the claim text.