Two-component thermally conductive adhesive

An uncured, two-part thermally conductive adhesive formulation having:

• a) a first component comprising:
• i) 1% to 25% of a silane-terminated urethane prepolymer by weight of the first component;
• ii) at least 70% of a first thermally conductive filler by weight of the first component;
• iii) 0.1% to 5% of a first organofunctional silane by weight of the first component;
• and
• iv) 0% to 10% of a first plasticizer by weight of the first component;
• and
• b) a second component comprising:
• i) 0.01% to 5% of water by weight of the second component;
• ii) at least 70% of a second thermally conductive filler by weight of the second component;
• iii) 0.1% to 5% of a polyetheramine by weight of the second component;
• iv) 0.1% to 5% of a second organofunctional silane by weight of the second component;
• and
• v) 1% to 20% of a second plasticizer by weight of the second component;
• wherein the uncured adhesive formulation is in the form of a kit in which the first and second components are not mixed.