Back to results
US 2026/0241674 A1Published application
Laminate manufacturing method and laminate manufacturing device
AssigneeDexerials Corporation
InventorTomokazu HINO
Life of this patent
Estimating the term…
Abstract
A laminate manufacturing method includes a bonding step of sticking a lamination film having a base film and an inorganic layer laminated on the base film to a substrate, and a cutting step of cutting the lamination film to match a shape of the substrate, wherein, in the cutting step, a cutting tool is heated to a temperature or higher that is lower by 65° C. than a softening point temperature of the base film, and the lamination film is cut.
Claims6
A laminate manufacturing method, comprising:
- a bonding step of sticking a lamination film having a base film and an inorganic layer laminated on the base film to a substrate;
- and
- a cutting step of cutting the lamination film to match a shape of the substrate,
- wherein, in the cutting step, a cutting tool is heated to a temperature or higher that is lower by 65° C. than a softening point temperature of the base film, and the lamination film is cut.
1 more element
A laminate manufacturing device, comprising:
- a bonding device configured to stick a lamination film having a base film and an inorganic layer laminated on the base film to a substrate;
- and
- a cutting device configured to cut the lamination film to match a shape of the substrate,
- wherein the cutting device has a heating mechanism that heats a cutting tool to a temperature or higher than 65° C. lower than a softening point temperature of the base film.
1 more element
Dependencies are inferred from the claim text.