Polishing compositions and methods of use thereof

Abstract

This disclosure relates to a method that includes applying a polishing composition to a substrate including elemental silicon on a surface of the substrate; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate. The polishing composition includes 1) at least one abrasive; 2) at least one silicon removal rate enhancer; 3) at least one compound that has a pKa of at least 10; 4) at least one pH adjusting agent; and 5) water, wherein the composition has a pH of at least 10.

Dependencies are inferred from the claim text.