System and method for operating semiconductor fabrication apparatus
AssigneesTsmc China Company Limited, Taiwan Semiconductor Manufacturing Company, Ltd.
InventorZhipeng CAO
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Abstract
A method for operating a semiconductor fabrication apparatus is provided. The method includes performing a deposition process on a wafer in a process chamber; opening the process chamber; and performing a maintenance process when the process chamber is opened. The maintenance process comprises placing a gas distribution plate over a lower chamber portion of the process chamber when the process chamber is open, wherein the gas distribution plate comprises a plurality of holes; and providing a purging gas through the holes of the gas distribution plate to a space surrounded by the lower chamber portion.
Claims20
A method for operating a semiconductor fabrication apparatus, comprising:
- performing a deposition process on a wafer in a process chamber;
- opening the process chamber;
- and
- performing a maintenance process when the process chamber is opened, wherein the maintenance process comprises:
- placing a gas distribution plate over a lower chamber portion of the process chamber when the process chamber is open, wherein the gas distribution plate comprises a plurality of holes;
- and
- providing a purging gas through the holes of the gas distribution plate to a space surrounded by the lower chamber portion.
A method for operating a semiconductor fabrication apparatus, comprising:
- performing a plasma process in a process chamber;
- opening the process chamber;
- and
- performing a maintenance process when the process chamber is opened, wherein the maintenance process comprises:
- flushing an interior of the process chamber with a purging gas;
- extracting the purging gas;
- detecting a particle number in the extracted purging gas;
- and
- adjusting a gas force of the purging gas according to the detected particle number.
A semiconductor fabrication apparatus, comprising:
- a process chamber comprising a lower chamber portion and a top chamber portion, wherein the top chamber portion is separated from the lower chamber portion when the process chamber is open;
- and
- a detachable gas supply system, comprising:
- a gas distribution plate detachably placed on the lower chamber portion when the process chamber is open, wherein the gas distribution plate comprises a plurality of holes;
- and
- a gas source fluidly connected with the holes of the gas distribution plate.
Dependencies are inferred from the claim text.