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US 2026/0236424 A1Published application
Interconnect link management and overhead reduction
AssigneeQUALCOMM Incorporated
InventorsVishal MISHRA, Srivatsan THIRUVENGADAM, Ramacharan SUNDARARAMAN
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Abstract
Certain aspects of the disclosure relate to an integrated circuit (IC) device that includes multiple chiplets that are connected using a die-to-die (D2D) interconnect link. The interconnect link can use a protocol that enables transmission of acknowledgement or feedback information in a data-carrying transaction layer packet and a non-data-carrying transaction layer packet.
Claims20
An integrated circuit (IC) device comprising:
- a first chiplet and a second chiplet;
- and
- a die-to-die (D2D) interconnect link connected between the first chiplet and the second chiplet,
- wherein the first chiplet is configured to send, to the second chiplet, a first transaction layer packet (TLP) comprising first data and a first sequence number associated with the first data;
- and
- wherein the second chiplet is configured to send, to the first chiplet, a second TLP that comprises:
- the first sequence number and first acknowledgement information corresponding to the first data;
- and
- selective second data generated by the second chiplet.
6 more elements
A method for data communication using a die-to-die (D2D) interconnect link, comprising:
- sending, from a first chiplet to a second chiplet, a first transaction layer packet (TLP) comprising first data and a first sequence number associated with the first data;
- and
- sending, from the second chiplet to the first chiplet, a second TLP that comprises:
- the first sequence number and first acknowledgement information corresponding to the first data;
- and
- selective second data generated by the second chiplet.
3 more elements
A system-on-chip (SoC), comprising:
- means for sending a first transaction layer packet (TLP) from a first chiplet to a second chiplet, the first TLP comprising first data and a first sequence number associated with the first data;
- and
- means for sending a second TLP from the second chiplet to the first chiplet, the second TLP comprises:
- the first sequence number and first acknowledgement information corresponding to the first data;
- and
- selective second data generated by the second chiplet.
3 more elements
Dependencies are inferred from the claim text.