Substrate processing apparatus and substrate processing method

Abstract

A wafer processing system is a substrate processing apparatus that executes a process related to EUV patterning comprising, and the system includes first processing devices each of which executes a process on the wafer W to which CAR is applied, and second processing devices each of which executes a process on the wafer W to which MOR is applied. Processing spaces of the first processing devices and processing spaces of the second processing devices are sectioned from each other. The plurality of second processing devices executes processes corresponding to the respective first processing devices.

Dependencies are inferred from the claim text.