Patterned substrate pre-wetting composition, use of pre-wetting composition for application directly onto patterned substrate, method for manufacturing resist pattern, method for manufacturing processed substrate, and method for manufacturing device

A method comprising:

• applying a pre-wetting composition directly onto a patterned substrate, wherein the pre-wetting composition comprises
• vapor pressure at 20° C. is 0.05 to 40 mmHg;
• and
• surface tension at 20° C. is 15 to 60 dyn/cm.

A method for manufacturing a resist pattern comprising:

• preparing a patterned substrate;
• applying a patterned substrate pre-wetting composition directly onto the patterned substrate;
• applying an underlayer film composition on the patterned substrate to form an underlayer film;
• optionally heating the underlayer film;
• forming a resist film directly on the underlayer film;
• and
• processing the resist film to form a resist pattern.