Low Resistance Hybrid Bonded Interconnects

A contact for hybrid bonding, comprising:

• a first end region of the contact with a first conductive material with a first average grain size;
• and
• a second end region of the contact with a second conductive material with a second average grain size smaller than the first average grain size of the first conductive material and formed on the first conductive material, wherein the second end region has a bonding surface and contains grain boundary pinning additives.

A non-transitory, computer readable medium having instructions stored thereon that, when executed, cause a method for reducing resistance of a contact to be performed, the method comprising:

• depositing a first end region of a first contact in an opening of a first substrate, wherein the first end region is formed of a first conductive material with a first average grain size;
• and
• depositing a second end region on the first end region of the first contact, wherein the second end region is a second conductive material which is deposited with a second average grain size smaller than the first average grain size.