Semiconductor package and method of manufacturing the same

A semiconductor package, comprising:

• a first redistribution circuitry structure;
• a photonic die disposed on the first redistribution circuitry structure;
• electronic dies disposed on the first redistribution circuitry structure and electrically connected to the phonic die through the first redistribution circuitry structure, wherein the electronic dies and the photonic die are located at opposite sides of the first redistribution circuitry structure;
• and
• a first encapsulation insulation disposed on the first redistribution circuitry structure and surrounding the electronic dies, wherein an outer edge of the first encapsulation insulation is coplanar with an outer edge of the photonic die.

A method of fabricating a semiconductor package comprising:

• forming a first redistribution circuitry structure on a photonic die, wherein an edge of the first redistribution circuitry structure is coplanar with an outer edge of the photonic die;
• electrically connecting electronic dies to the phonic die through the first redistribution circuitry structure;
• and
• forming an encapsulation insulation surrounding the electronic dies.