Ultra-thin side-emitting led package structure with built-in driver ic die

An ultra-thin side-emitting light emitting diode (LED) package structure with a built-in driver integrated circuit (IC) die, comprising a housing, a metal pad fixed inside the housing, and the driver IC die fixedly provided at a middle position of the metal pad, wherein a surface of the driver IC die is coated with a reflective coating, one side of the driver IC die is provided with RGB light-emitting dies fixedly provided on the metal pad, beveled reinforcement structures are provided at a die-bonding area of a surface of the metal pad, the beveled reinforcement structures at left and right two sides of the driver IC die are symmetrically provided, reinforcing protrusions are provided at positions of an inner wall of the housing near an edge of the metal pad, and the reinforcing protrusions are provided offset from die-bonding positions and bonding wire positions.