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US 2026/0231545 A1Published application
Image sensor package
AssigneeSamsung Electronics Co., Ltd.
InventorDu Sik JUNG
Life of this patent
Estimating the term…
Abstract
An image sensor package including: a package substrate, a first image sensor chip on the package substrate, a second image sensor chip on the package substrate and spaced apart from the first image sensor chip, and a dust trap on the package substrate and between the first image sensor chip and the second image sensor chip, wherein the dust trap is configured to capture foreign matter.
Claims20
An image sensor package comprising:
- a package substrate;
- a first image sensor chip on the package substrate;
- a second image sensor chip on the package substrate and spaced apart from the first image sensor chip;
- and
- a dust trap on the package substrate and between the first image sensor chip and the second image sensor chip,
- wherein the dust trap is configured to capture foreign matter.
3 more elements
An image sensor package comprising:
- a package substrate comprising a first surface and a second surface opposite the first surface;
- a first image sensor chip mounted on the first surface of the package substrate;
- a second image sensor chip mounted on the first surface of the package substrate and spaced apart from the first image sensor chip in a first direction;
- a dust trap between the first image sensor chip and the second image sensor chip;
- two fixing members between the first image sensor chip and the second image sensor chip, and spaced apart in a second direction;
- a transparent cover spaced apart from upper portions of the first image sensor chip and the second image sensor chip in a third direction;
- and
- a dam interposed between the first image sensor chip and the transparent cover,
- wherein the dam is interposed between the second image sensor chip and the transparent cover,
- wherein the dam is configured to bond the first image sensor chip and the transparent cover, and bond the second image sensor chip and the transparent cover.
7 more elements
An image sensor package comprising:
- a package substrate comprising a first surface and a second surface opposite the first surface;
- a first image sensor chip mounted on the first surface of the package substrate;
- a second image sensor chip mounted on the first surface of the package substrate and spaced apart from the first image sensor chip in a first direction;
- an adhesive member between the first surface of the package substrate and both of the first image sensor chip and the second image sensor chip, and configured to bond the package substrate to both of the first image sensor chip and the second image sensor chip;
- a dust trap between the first image sensor chip and the second image sensor chip;
- two fixing members between the first image sensor chip and the second image sensor chip and spaced apart in a second direction;
- a transparent cover spaced apart from upper portions of the first image sensor chip and the second image sensor chip in a third direction;
- a sealing member on the first surface of the package substrate, surrounding side surfaces of the first image sensor chip and the second image sensor chip, and surrounding side surfaces of the two fixing members;
- and
- a dam interposed between the first image sensor chip and the transparent cover, and between the second image sensor chip and the transparent cover,
- wherein the dam is configured to bond the first image sensor chip and the transparent cover, and bond the second image sensor chip and the transparent cover,
- wherein a thickness of the dust trap is less than a thickness of the first image sensor chip and a thickness of the second image sensor chip,
- wherein an uppermost surface of the two fixing members is coplanar with an uppermost surface of the first image sensor chip and the second image sensor chip, and
- wherein the image sensor package further comprises a mask pattern in a portion of an upper surface of the transparent cover.
11 more elements
Dependencies are inferred from the claim text.