Semiconductor structure and manufacturing method thereof
AssigneeWinbond Electronics Corp.
InventorsYi-Chi Tsai, Feng-Jung Chang, Wei-Che Chang, Yung-Wen Hung
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AssigneeWinbond Electronics Corp.
InventorsYi-Chi Tsai, Feng-Jung Chang, Wei-Che Chang, Yung-Wen Hung
Estimating the term…
A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate having an active area, a plurality of word line structures, a doped region, a plurality of pillar structures, a spacer and a contact. The plurality of word line structures are disposed in the substrate. The extending direction of the word line structure intersects with the extending direction of the active area. The doped region is disposed in the substrate in the active area and located between adjacent word line structures. The plurality of pillar structures are disposed on the substrate to surround the doped region. The spacer is disposed on the sidewalls of the pillar structures, so that the pillar structures and the spacer cover the ends of the active area together. The contact is disposed on the doped region and in contact with the spacer.
A semiconductor structure comprising:
A manufacturing method of a semiconductor structure, comprising:
Dependencies are inferred from the claim text.