Cooling solutions with anisotropic thermal conductivity
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Ercan Mehmet Dede, Shailesh Joshi
Life of this patent
Estimating the term…
Abstract
Devices and methods for thermal management are provided. The device comprises one or more thermally conducting regions, and each thermal conducting region includes a composite material containing thermally conductive fillers that are capable of being oriented in a direction by applying an external force. The method includes steps of forming each thermal conducting region and thereby forming a thermal management device with designed anisotropic thermal conductivity.
Claims20
A thermal management device for cooling a power device, comprising at least one of a thermal interface material and a heat sink, wherein:
- the thermal interface material or the heat sink or both independently comprise one or more of thermal conducting regions;
- and
- each thermal conducting region independently comprises a composite material comprising a matrix material and a plurality of thermally conductive fillers, wherein, for each thermal conducting region:
- the plurality of thermally conductive fillers are oriented in a direction, generating an anisotropic thermal conductivity;
- and
- the plurality of thermally conductive fillers are thermally coupled to form a plurality of thermal conducting paths, operable to conduct heat from one or more heat sources of the power device.
A method of forming a thermal management device for cooling a power device, comprising:
- depositing a thermal interface material, a heat sink, or both on to the power device, wherein a first portion of the thermal interface material, the heat sink, or both independently comprise a composite material comprising a matrix material and a plurality of thermally conductive fillers;
- applying a first external force to the first portion of the thermal interface material, the heat sink, or both;
- orienting, within the first portion of the thermal interface material, the heat sink, or both, the plurality of thermally conductive fillers in a first direction;
- curing the first portion of the thermal interface material, the heat sink, or both;
- and
- thereby forming, within the first portion of the thermal interface material, the heat sink, or both, one or more thermal conducting regions comprising a first anisotropic thermal conductivity in the first direction.
Dependencies are inferred from the claim text.