Cold plates with composite foam structures and methods of manufacturing the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsErcan Mehmet Dede, Shailesh N. Joshi
Life of this patent
Estimating the term…
Abstract
A cold plate for an electronic and/or electromechanical device includes a first face panel and a second face panel spaced apart from the first face panel, and a matrix of high thermal conductivity (HTC) spheres and a matrix of low thermal conductivity (LTC) spheres disposed between inner surfaces of the first and second face panels. The matrix of HTC spheres defines a heat conducting pathway between the first and second face panels, and the matrix of LTC spheres defines a thermal insulated region between the first and second face panels.
Claims20
A cold plate for an electronic and/or electromechanical device, the cold plate comprising:
- a first face panel and a second face panel spaced apart from the first face panel;
- and
- a matrix of high thermal conductivity (HTC) spheres and a matrix of low thermal conductivity (LTC) spheres disposed between inner surfaces of the first and second face panels, the matrix of HTC spheres defining a heat conducting pathway between the first and second face panels, and the matrix of LTC spheres defining a thermal insulated region between the first and second face panels.
A cold plate for an electronic and/or electromechanical device, the cold plate comprising:
- a first face panel and a second face panel spaced apart from the first face panel;
- a matrix of HTC spheres and a matrix of LTC spheres disposed between inner surfaces of the first and second face panels, the matrix of HTC spheres defining a heat conducting pathway between the first and second face panels, and the matrix of LTC spheres defining a thermal insulated region between the first and second face panels;
- a heat source in thermal communication with an outer surface of the first face panel;
- and
- a heat sink in thermal communication with an outer surface of the second face panel, the heat conducting pathway enhancing heat transfer between the heat source and the heat sink, and the thermal insulated region reducing heat transfer between the heat source and a heat insulated region on the second face panel.
A cold plate for an electronic and/or electromechanical device, the cold plate comprising:
- a first face panel and a second face panel spaced apart from the first face panel;
- a polymer matrix between inner surfaces of the first and second face panels;
- a matrix of HTC spheres and a matrix of LTC spheres embedded in the polymer matrix, the matrix of HTC spheres defining a heat conducting pathway between the first and second face panels, and the matrix of LTC spheres defining a thermal insulated region between the first and second face panels;
- a heat source in thermal communication with an outer surface of the first face panel;
- and
- a heat sink in thermal communication with an outer surface of the second face panel, the heat conducting pathway enhancing heat transfer between the heat source and the heat sink, and the thermal insulated region reducing heat transfer between the heat source and a heat insulated region on the second face panel.
Dependencies are inferred from the claim text.