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US 2026/0231318 A1Published application
Liquid-Cooling Embedded Chip Lid
AssigneeMikros Technologies LLC
InventorsDrew M. Matter, Jesse D. McGowan, Joseph T. Sullivan, Joseph Andrew Vivio
Life of this patent
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Abstract
A microprocessor assembly that includes a printed circuit board (PCB), a microprocessor coupled to the PCB, and a manifold coupled to the PCB and at least partially surrounding the microprocessor. The manifold defines one or more channels that are configured to receive fluid flow through at least a portion of the one or more channels to thermally regulate the microprocessor.
Claims20
A microprocessor assembly, comprising:
- a printed circuit board (PCB);
- a microprocessor coupled to the PCB;
- and
- a manifold coupled to the PCB and at least partially surrounding the microprocessor, wherein the manifold defines one or more channels configured to receive fluid flow through at least a portion of the one or more channels to thermally regulate the microprocessor.
1 more element
A manifold configured to thermally regulate a microprocessor in thermal communication with the manifold, comprising:
- a cavity defined by the manifold and configured to contain the microprocessor;
- an inlet port that is configured to regulate fluid flow entering the cavity;
- an outlet port that is configured to regulate the fluid flow exiting the cavity;
- and
- one or more channels defined by the manifold and located within the cavity,
- wherein to thermally regulate the microprocessor, at least a portion of the one or more channels are configured to receive the fluid flow therein.
3 more elements
A microprocessor assembly, comprising:
- a printed circuit board (PCB);
- a microprocessor coupled to the PCB, wherein the microprocessor defines one or more channels along a surface of the microprocessor;
- and
- a manifold coupled to the PCB, wherein the manifold and the PCB define a void therebetween, the microprocessor is located in the void, and the one or more channels are configured to receive fluid flow through at least a portion of the one or more channels to thermally regulate the microprocessor.
1 more element
Dependencies are inferred from the claim text.