Mems acoustic sensing chip, microphone and electronic device
AssigneeWeifang Goertek Microelectronics Co., Ltd.
InventorQuanbo Zou
Life of this patent
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AssigneeWeifang Goertek Microelectronics Co., Ltd.
InventorQuanbo Zou
Estimating the term…
The disclosure includes a MEMS acoustic sensing chip, a microphone, and an electronic device. The MEMS acoustic sensing chip includes a substrate provided with a back cavity, a first diaphragm, a second diaphragm, a backplate, and a support structure; the first diaphragm, the second diaphragm, and the backplate are provided on one side of the substrate through the support structure, the first diaphragm and the second diaphragm are provided with an inner cavity therebetween, and the backplate is suspended in the inner cavity; the support structure is provided with a vent hole, the vent hole being in communication with the back cavity and being independent of the inner cavity; and at least one of the first diaphragm and the second diaphragm is provided with a release hole, which is in communication with the inner cavity.
A MEMS acoustic sensing chip, comprising a substrate provided with a back cavity, a first diaphragm, a second diaphragm, a backplate, and a support structure;
Dependencies are inferred from the claim text.