Thermally conductive resin composition and thermally conductive member
AssigneeSekisui Chemical Co., Ltd.
InventorsYusuke KOBAYASHI, Atsushi FURUKAWA, Tatsuya IWAMOTO, Tetsuro YOSHIOKA
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Abstract
A thermally conductive resin composition comprising an epoxy resin, an amine curing agent having three or more active hydrogen atoms of an amino group, and a thermally conductive filler, and having an equivalent ratio of the active hydrogen atoms of the amino group to an epoxy group of more than 1 and less than 2.7.
Claims17
A thermally conductive resin composition comprising an epoxy resin, an amine curing agent having three or more active hydrogen atoms of amino group, and a thermally conductive filler, and having an equivalent ratio of active hydrogen atoms of amino group to epoxy groups of more than 1 and 2.7 or less.
Dependencies are inferred from the claim text.