US 2026/0229410 A1Published application

Multilayer electronic component

AssigneeSamsung Electro-Mechanics Co., Ltd.

InventorYoung Jun CHA

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Abstract

A multilayer electronic component includes a body having a capacitance formation portion with dielectric layers and internal electrodes alternately stacked in a thickness direction, and a cover portion disposed on the capacitance formation portion. The cover portion includes at least one dummy electrode exposed on a side surface of the body. An external electrode includes a connection portion on opposite end surfaces of the body and a side portion extending to cover the dummy electrode. A ratio of a width of the side portion to a width of a band portion is between 40% and 100%, and a ratio of a thickness of the side portion to a thickness of the external electrode is between 4% and 50%, improving bonding strength and reliability.

Claims18

Dependent claims

A multilayer electronic component comprising:

a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a thickness direction, and a cover portion disposed on the capacitance formation portion in the thickness direction, the body having first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces, the third and fourth surfaces opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces, the fifth and sixth surfaces opposing each other in a width direction;
an external electrode including a connection portion disposed on the fifth and sixth surfaces, and a band portion disposed to extend from the connection portion onto the first and second surfaces,
wherein the cover portion includes at least one dummy electrode exposed to at least one of the third and fourth surfaces,
the external electrode includes a side portion extending from the band portion onto at least one of the third and fourth surfaces, the side portion disposed to cover the dummy electrode exposed to at least one of the third and fourth surfaces,
a ratio (SBW/BW) of a size in the width direction (SBW) of the side portion to a size in the width direction (BW) of the band portion satisfies 40%≤SBW/BW≤100%, and
a ratio (SBT/ET) of a size in the thickness direction (SBT) of the side portion to a size in the thickness direction (ET) of the external electrode satisfies 4%≤SBT/ET≤50%.

3 more elements

A multilayer electronic component comprising:

a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a thickness direction, and a cover portion disposed on the capacitance formation portion in the thickness direction, the body having first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces, the third and fourth surfaces opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces, the fifth and sixth surfaces opposing each other in a width direction;
and
an external electrode including a connection portion disposed on the fifth and sixth surfaces, and a band portion disposed to extend from the connection portion onto the first and second surfaces,
wherein the cover portion includes at least one dummy electrode exposed to at least one of the third and fourth surfaces,
the external electrode includes a side portion extending from the band portion onto at least one of the third and fourth surfaces, the side portion disposed to cover the dummy electrode exposed to at least one of the third and fourth surfaces,
a ratio (SBW/BW) of a size in the width direction (SBW) of the side portion to a size in the width direction (BW) of the band portion satisfies 46%≤SBW/BW≤100%, and
a thickness (T) of the multilayer electronic component satisfies 0.05 mm≤T≤0.3 mm.

4 more elements

A multilayer electronic component comprising:

a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a thickness direction, and a cover portion disposed on the capacitance formation portion in the thickness direction, the body having first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces, the third and fourth surfaces opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces, the fifth and sixth surfaces opposing each other in a width direction;
and
an external electrode including a connection portion disposed on the fifth and sixth surfaces, and a band portion disposed to extend from the connection portion onto the first and second surfaces,
wherein the cover portion includes at least one dummy electrode exposed to at least one of the third and fourth surfaces,
the external electrode includes a side portion extending from the band portion onto at least one of the third and fourth surfaces, the side portion disposed to cover the dummy electrode exposed to at least one of the third and fourth surfaces,
a ratio (SBT/ET) of a size in the thickness direction (SBT) of the side portion to a size in the thickness direction (ET) of the external electrode satisfies 7%≤SBT/ET≤50%, and
a thickness (T) of the multilayer electronic component satisfies 0.05 mm≤T≤0.3 mm.

4 more elements

Dependencies are inferred from the claim text.