Back to results
US 2026/0229401 A1Published application
Coil component, and electronic component, semiconductor component, and substrate including coil component
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshimasa YOSHIOKA, Kenji TOYOSHIMA, Kouji YAMAUCHI
Life of this patent
Estimating the term…
Abstract
A coil component includes an element body including a magnetic layer, and a first coil wiring disposed in the element body. The magnetic layer includes resin, first metal magnetic powder, first iron oxide magnetic powder, and a void portion, and an average particle diameter of the first metal magnetic powder is larger than an average particle diameter of the first iron oxide magnetic powder.
Claims22
A coil component comprising:
- an element body including a magnetic layer;
- and
- a first coil wiring in the element body, wherein
- the magnetic layer includes resin, first metal magnetic powder, first iron oxide magnetic powder, and at least one void portion, and
- an average particle diameter of the first metal magnetic powder is larger than an average particle diameter of the first iron oxide magnetic powder.
2 more elements
Dependencies are inferred from the claim text.